Vertical integration, end to end
We run the full chain on our own floor: incoming die screening, SMT/COB placement, housing assembly, marking and branding, then capacity verification and packing. A physical sample is approved before bulk production starts.
- Wafer sorting & testing — Die-level screening before packaging.
- COB bonding / SMT placement — Bare die or packaged part onto the PCB.
- Housing & assembly — Metal, PVC or wood housing assembly.
- Marking & branding — Silk-screen, colour print, laser engraving.
- Test & pack — Capacity / read-write verification, then packaging.