UDP Module Manufacturer in China — Embedded Flash Modules
WINTEL is a UDP (USB Disk in Package) module manufacturer, not a trading company. A UDP module is the electronic core of a USB flash device — NAND, controller and passives moulded into a single package that is soldered directly onto your PCB as fixed internal storage. We produce them on our own floor in Shenzhen, China, at 11.3 × 24.8 × 1.45 mm and 0.819 g, from 128MB to 128GB, for embedded and industrial device makers who need storage that enumerates reliably and survives without a separate connector. Capacity, silicon grade, controller solution and testing are set to your specification. The legal entity is Shenzhen Wintel Digital Technology Limited, registered in China since 2015.
What we manufacture
UDP modules (USB Disk in Package)
Soldered onto your own PCB as fixed internal storage — no connector, no loose drive.
Semi-finished USB boards
The bare PCBA when you run your own housing or final assembly.
Finished USB flash drives
When you need the complete drive rather than the embedded core.
Who we supply
Embedded device manufacturers
You design the board and need a storage core that solders in place and enumerates the same way on every unit — dashcams, IP cameras, POS terminals, kiosks, medical and industrial controllers.
Industrial equipment manufacturers
You need fixed storage that is not a removable consumer drive — no card slot to loosen, no connector to corrode, no user pulling the wrong media.
IoT and appliance makers
You ship firmware, logs or configuration on a core that is part of the product, not a peripheral the customer swaps.
Assembly lines and integrators
You take the UDP or the semi-finished board and run your own housing, conformal coating or final test.
What you can specify
| Variable | What you choose |
|---|---|
| Package | UDP (11.3 × 24.8 × 1.45 mm) or semi-finished board (12 × 44 × 4.5 mm) |
| Capacity | 128MB to 128GB |
| Interface | USB 2.0 or USB 3.0 |
| Silicon | SanDisk, Toshiba, Micron, SK Hynix, Intel, Samsung — TSOP, BGA, LGA, COB, eMMC |
| Controller | Alcor, ITE, Xinbang, Micov — QFN, 24-pin, 48-pin, COB |
| Testing | Capacity and read/write verification before packing |
Manufacturer versus trading company — what actually differs
| Factory-direct (WINTEL) | Through a trading company | |
|---|---|---|
| Where the specification is set | On our own floor — capacity, controller, silicon grade and testing are configured against your order. | By whichever factory takes the order that week. |
| What happens when material is short | You are told before a substitution is made, because the silicon and controller are documented in the specification we quote. | Substitution happens between you and the end factory, usually without notice. |
| Who owns the quality check | Capacity and read/write verification run as part of our own production flow, before packing. | Whatever the supplying factory did, which you cannot audit. |
| What you can ask to see | The process, the test method and the registration record of the legal entity you are contracting with. | A catalogue. |
This comparison describes our own operation, not a claim about any named third party.
The legal entity you would be contracting with
- Legal name (EN)Shenzhen Wintel Digital Technology Limited
- Legal name (CN)深圳市微盛鑫数码科技有限公司
- RegisteredChina, 2015-05-12
- Team in this industry since2006
- FactoryShenzhen, Guangdong, China
- Factory floor5,000 m²
- Export markets50+ countries
Send a specification, get a quote
Tell us the capacity, quantity, application and target date. We reply to business enquiries within 1 business day.
Request a quoteFrequently asked questions
Are you a UDP module manufacturer or a trading company?
A manufacturer. Shenzhen Wintel Digital Technology Limited produces UDP modules on its own floor in Shenzhen. We are not a reseller, a distributor or a marketplace seller.
What is a UDP module, exactly?
UDP means USB Disk in Package — NAND, controller and passive components moulded into one small package (11.3 × 24.8 × 1.45 mm) that is soldered onto your PCB as fixed internal storage. It is the core of a USB drive, without the connector and housing.
What capacities do your UDP modules cover?
From 128MB to 128GB. Tell us the device the module must serve and we size the capacity and grade to that workload rather than defaulting to a single option.
How do you keep the module consistent across batches?
Capacity, silicon grade, controller solution and testing are stated on your quotation and held as quoted through production. A shortage becomes a conversation before any substitution, not a surprise on arrival.
Can you provide the semi-finished board instead of the UDP?
Yes. The semi-finished USB board (12 × 44 × 4.5 mm) is the bare PCBA for buyers who run their own housing or final assembly. The UDP is the moulded core for buyers who solder directly.
Which silicon and controllers do you use?
SanDisk, Toshiba, Micron, SK Hynix, Intel, Samsung, in TSOP, BGA, LGA, COB and eMMC formats, at A+ grade, with controllers from Alcor, ITE, Xinbang, Micov. We are not an authorised agent for any NAND brand — we buy and sort flash and state the grade and source against your project.
Do you have certifications?
We list only certifications we hold and can show documentation for. Where a certificate is not yet published on our site, we do not claim it.